ENNOVI has introduced ENNOVI-SealTech, an EV busbar sealing technology aimed at eliminating coolant leakage in hybrid and electric vehicle (xEV) drivetrains. The system offers OEMs a reliable method of sealing busbar interfaces in critical areas like motors, inverters, and oil pump connections, ENNOVI said.
“Managing busbar interfaces in EVs where coolant is present on one side and a dry, electrically robust connection is required on the other side, presents several challenges,” said Dominik Pawlik, Product Portfolio Director for Power Interconnects at ENNOVI. “Conventional sealing methods incur the high cost and time for secondary processes and/or issues with leakage over the lifetime of the assembly. SealTech overcomes all these limitations.”
Flexible Sealing with No Post-Processing Required
ENNOVI-SealTech features two customizable sealing options:
- Double-walled shrink tubes;
- Adhesive sealing tape for complex geometries.
Both methods eliminate the need for post-processing. ENNOVI said this streamlines production and offering increased design flexibility without sacrificing durability or sealing effectiveness.
ENNOVI-SealTech is Validated for Harsh EV Environments
The ENNOVI-SealTech system undergoes rigorous testing for thermal and mechanical resilience. Validations include:
- Thermal aging: 150°C for 1,000 hours;
- Thermal shock cycling: -40°C to +150°C for 600 cycles (15 minutes each);
- Leak testing: to confirm long-term sealing integrity.
These tests meet EN 60068-2 standards, ensuring it performs reliably in demanding EV environments, ENNOVI said.
Adaptable to Diverse Materials and Geometries
ENNOVI-SealTech applies to virtually any busbar shape. It is compatible with a wide range of materials, including copper, aluminum, and common thermoplastics such as PA66, PBT, and PC. This adaptability allows the technology to meet varying application needs across multiple EV platforms.
The post ENNOVI Launches SealTech, a Busbar Sealing Technology for EVs appeared first on The Buzz – Electric Vehicle News.
Read the full article here
